Cu interconnect technologies in Fujitsu and problems in installing Cu equipment in an existing semiconductor manufacturing line

Summary form only given. In this paper, Cu interconnect technologies in Fujitsu targeted for the 0.18 /spl mu/m generation and beyond are introduced. Some new integration schemes for Cu wiring are also demonstrated, targeted for the 0.13 /spl mu/m generation. Finally, we discuss some important aspects of installation of Cu equipment in an existing semiconductor manufacturing line.