The quantitation of surface modifications in 200 and 300 mm wafer processing with an automated contact angle system

Contact angle measurement, using advanced instrumentation, is assuming an increased role in monitoring those semiconductor manufacturing processes which modify the surface characteristics of wafers. Such measurements can provide rapid, nondestructive and spatially and time resolved data in an automated mode. This information can be related to processing uniformity and can in many cases provide information on the chemical state of the surface. Illustrations are provided in the wafer cleaning, lithography, and interconnect areas. New application areas illustrated include measurement of the uniformity of UV photostabilization processes, measurement of contrast curves, and determination of receding and advancing contact angles of processed copper wafers.