Design Optimization of Single-Layer Antireflective Coating for GaAs$_{{\bf 1-}{\bm x}}$P$_{\bm x}$/Si Tandem Cells With $\hbox{x} = \hbox{0}$, 0.17, 0.29, and 0.37

Single-layer antireflective coating (SLARC) materials and design for GaAs1_xPx/Si tandem cells were analyzed by TCAD simulation. We have shown that optimum SLARC thickness is a function of bandgap, thickness, and material quality of top GaAs
_1-x
P
_x
/Sisubcell. Cells are analyzed for P fractions x = 0, 0.17, 0.29, and 0.37, and ARC materials: Si
₃
N
₄
, SiO
₂
, ITO, 11fO
₂
, and Al
₂
O
₃
. Optimum ARC thickness ranges from 65-75 nm for Si
₃
N
₄
and ITO to ~100-110 nm for SiO2. Optimum ARC thickness increases with increasing GaAs1_xPx absorber layer thickness and with decreasing P fraction x. Simulations show that optimum GaAs
_1-x
P
_x
/Siabsorber layer thickness is not a strong function of ARC material, but it increases from 250 nm for x = 0 to1 μm for x = 0.29 and 0.37. For all P fractions, Si
₃
N
₄
, 11fO
₂
, and Al
₂
O
₃
performed almost equally, while SiO2 and ITO resulted in ~1% and ~2% lower efficiency, respectively. Optimum SLARC thickness increases as the material quality of the top cell increases. The effect of ARC material decreases with decreasing GaAs1_xPx material quality. The maximum efficiencies are achieved for cells with ~1-μm GaAs0.71P0.29 absorber (r = 10 ns): ~26.57% for 75-nm Si
₃
N
₄
SLARC and 27.62% for 75-nm SiO2/60-nm Si
₃
N
₄
double-layer ARC.