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Energy-per-bit advantages of chip-scale hybrid-integrated optical interconnects using surface-normal electro-aborption MQW modulators

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3 Author(s)
Michael W. Haney ; Department of Electrical and Computer Engineering University of Delaware Newark, DE, USA ; Tian Gu ; Anupama P. Venkataraman

A hybrid MQW/EAM-based chip-scale photonic interconnect concept is projected to achieve significantly lower energy-per-bit performance than monolithically integrated Si-Photonic and directly-modulated VCSEL approaches - enabling bandwidth density to scale with foreseeable high performance computing CMOS technology.

Published in:

2013 Optical Interconnects Conference

Date of Conference:

5-8 May 2013