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Magnetic Self-Assembly of Ultra-Thin Chips to Polymer Foils

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2 Author(s)
Kuran, E.E. ; Micro & Nano Eng. Lab., Delft Univ. of Technol., Delft, Netherlands ; Tichem, M.

A self-assembly process is developed for the placement and alignment of Ultra-Thin Chips (UTCs) to polymer foils. The chips are presented within the working range of a magnetic force field, and subsequently driven to and aligned at a target location. A low-viscosity die attach adhesive layer supports chip mobility during alignment, and is UV-cured after assembly to generate a mechanical bond. An adaptive electrical interconnection scheme compensates the position errors present after assembly. Standard Ni + Au bumps provide sufficient magnetization to generate the required alignment force. Numerical modeling confirms that over a long range magnetic forces operate on a chip and drive it to a target location. Also, an asymmetric bump arrangement supports achieving a unique in-plane orientation. Experimentally, chips with a thickness of 20 μm were successfully trapped and aligned with a repeatability of ±100 μm in x and y-direction, and the best achieved cycle time is below 1.0 s. The cycle time depends considerably on the viscosity of the die attach adhesive. The presence of unique in-plane orientations, depending on the bump arrangement, is demonstrated.

Published in:

Automation Science and Engineering, IEEE Transactions on  (Volume:10 ,  Issue: 3 )

Date of Publication:

July 2013

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