Cart (Loading....) | Create Account
Close category search window

Magnetic Self-Assembly of Ultra-Thin Chips to Polymer Foils

Sign In

Full text access may be available.

To access full text, please use your member or institutional sign in.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Kuran, E.E. ; Micro & Nano Eng. Lab., Delft Univ. of Technol., Delft, Netherlands ; Tichem, M.

A self-assembly process is developed for the placement and alignment of Ultra-Thin Chips (UTCs) to polymer foils. The chips are presented within the working range of a magnetic force field, and subsequently driven to and aligned at a target location. A low-viscosity die attach adhesive layer supports chip mobility during alignment, and is UV-cured after assembly to generate a mechanical bond. An adaptive electrical interconnection scheme compensates the position errors present after assembly. Standard Ni + Au bumps provide sufficient magnetization to generate the required alignment force. Numerical modeling confirms that over a long range magnetic forces operate on a chip and drive it to a target location. Also, an asymmetric bump arrangement supports achieving a unique in-plane orientation. Experimentally, chips with a thickness of 20 μm were successfully trapped and aligned with a repeatability of ±100 μm in x and y-direction, and the best achieved cycle time is below 1.0 s. The cycle time depends considerably on the viscosity of the die attach adhesive. The presence of unique in-plane orientations, depending on the bump arrangement, is demonstrated.

Published in:

Automation Science and Engineering, IEEE Transactions on  (Volume:10 ,  Issue: 3 )

Date of Publication:

July 2013

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.