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3D technologies need a high speed high alignment accuracy chip-to-wafer hybridation technique. This paper will focus on chip-to-wafer self assembly processes coupled with direct bonding hybridation. Submicronic alignment accuracy and a 90 per cent self-assembly process yield are obtained. The self-assembly process yield is analyzed in term of alignment accuracy and direct bonding quality. The impact of the chip's surface state (hydrophilic, hydrophobic, and mixed) on fluid containment efficiency and self-assembly process yield will be discussed. Topological containment (canthotaxis effect) is also evaluated with regards to structures height. Finally, the alignment yield as a function of deposition parameters will be described.