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The effect of solder paste viscosity on porosity and mechanical properties of surface mount solder joints

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4 Author(s)
Y. Tian ; City Univ. of Hong Kong, Kowloon, Hong Kong ; Y. C. Chan ; J. K. L. Lai ; S. T. F. Pak

This paper reports, for the first time, the results of a systematic experimental investigation of solder paste viscosity on the porosity and mechanical properties of surface mount solder joints. By means of X-ray radiography, it is generally observed that solder joints have greater porosity area fraction for higher solder paste viscosity, with increasing viscosity from 35.3-213 Pa.s, the porosity area fraction varies from 3.0-9.9%, respectively. Thermogravitational analyses on these solder pastes were performed to explain the observed phenomena. It is found that the solder paste with lower viscosity range has a larger evaporation rate of organics than those with higher viscosity range before metal alloys melting, but a smaller rate after metal alloys melting. Shear test results demonstrate that solder joints fabricated with lower viscosity solder paste have higher shear strength by up to 30% (increased from 35.3-46.3 MPa for viscosity change from 213-35.2 Pa.s, respectively)

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:20 ,  Issue: 2 )