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Keynote speakers day 1: 3D integration with TSV interconnects: Technology trends & market analysis

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1 Author(s)
Christophe Zinck ; Yole Développement France

Christophe joined Yole Développement after several positions in the wafer fab and packaging environments of CEA-Leti, STMicroelectronics and then TriQuint Semiconductor, where he has developed Wafer Level packaging technology and flipchip technology for SAW duplexers. He is now project manager at Yole for Advance Packaging, WLP & 3D system Integration and RF devices.

Published in:

3D Systems Integration Conference (3DIC), 2010 IEEE International

Date of Conference:

16-18 Nov. 2010