By Topic

Heterogeneous integration technology for MEMS-LSI multi-chip module

Sign In

Full text access may be available.

To access full text, please use your member or institutional sign in.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

8 Author(s)
K-W Lee ; Dept. of Bioengineering and Robotics, Tohoku University., Sendai, 980-8579, Japan ; S. Kanno ; Y. Ohara ; K. Kiyoyama
more authors

We developed novel interconnection technology for heterogeneous integration of MEMS and LSI multi-chip module, in which MEMS and LSI chips would be horizontally integrated on substrate and vertically stacked each others. The cavity chip composed of deep Cu TSV-beam lead wires was developed for interconnecting MEMS chips with high step height of more than 100 um. Fundamental characteristics were successfully obtained from pressure sensing MEMS chip with 360 mum thickness, which was connected to the substrate by the cavity chip. MEMS and LSI chips were vertically integrated by using the cavity chip without changes of chip design and extra processes. This interconnection technology can give strong solution for heterogeneous integration of MEMS and LSI chips multi-chip module.

Published in:

3D System Integration, 2009. 3DIC 2009. IEEE International Conference on

Date of Conference:

28-30 Sept. 2009