Electronics Packaging and Test Fixturing for the 500C Environment

Those involved in the development and characterization of high temperature devices or systems know that there are very few commercially available components with which to construct sockets, bum-in cards, packages or associated test fixturing capable of withstanding extended periods of high temperature exposure. This is especially so when the test temperatures exceed 300°C. This paper will describe an approach to high temperature device testing and characterization used at the United Technologies Research Center to temperatures exceeding 500°C. The required packages, sockets and bum-in cards will be described and the basic fabrication sequence used to build them will be outlined.