Guidelines for high-performance electronic package interconnections-a simple approach

Guidelines are introduced for designing high-performance interconnections in high-density electronic packages. Three electrical constraints (namely a transient response requirement of the system, an undershoot requirement at the load end of the driven line, and a crosstalk requirement at the load end of the quiet line) relate the design parameters. A simple design algorithm is discussed that relates design parameters. This method is valid for small-capacitive-loads, low-loss lines, and loosely-coupled lines. Ranges for parameters are specified within which the approach is valid. Design curves are presented for this simplified design method. To increase packaging density line cross sections and spacings must be reduced. As a result line loss and line coupling increase. The simple design guidelines presented here show that these trends need not jeopardize circuit performance if s/h/spl ges/0.8 with C/sub L//spl les/0.3 and r/sub D//spl ges/0.45. For systems with parameters outside these ranges, other approaches are needed.