Novel DSC-IPM for Compact Converters at Elevated Temperatures

A novel two-side cooling for integrated power modules (IPMs) for improved compactness and capability for elevated temperature operations is presented. This approach applies and improves off-the-shelf products of IPM without significantly changing original packaging and fabrication process. It can reduce a device's p-n junction-temperature rise by 20% at an equivalent load, thus increasing operating ambient temperatures, which is desirable for aircraft applications. The size and volume associated with a conventional cooling mechanism can be reduced, achieving improved compactness and power density.