90 nm generation, 300 mm wafer low k ILD/Cu interconnect technology

This paper presents a 90 nm generation and 300 mm wafer size interconnect technology with 7 layers of Cu metallization and low k ILD. Carbon doped oxide (CDO) low k ILD is used to achieve > 20% inter- and intra-layer capacitance improvement and 25-30% RC improvement over 130 nm generation SiOF interconnect process with equivalent electromigration performance.