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Thermal Considerations for Plastic Encapsulation or Coating in Electronic Product Design

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2 Author(s)
Fairbanks, D. ; Raytheon Company, Mass ; Mark, M.

The effects ofusing plastic compounds for encapsulation or coating of electronic circuitry are discussed with respect to cooling. The basic thermal mechanisms are presented. It is concluded that encapsulation or coating can significantly improve the cooling of small compact circuitry not employing direct metallic conduction paths or direct forced convection.

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Product Engineering and Production, IRE Transactions on  (Volume:6 ,  Issue: 2 )