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Temporary bonding strength control for self-assembly-based 3D integration

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7 Author(s)
Fukushima, T. ; New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan ; Ohara, Y. ; Bea, J. ; Murugesan, M.
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We have demonstrated bonding strength control for self-assembly-based 3D integration in which many chips are instantly assembled on a wafer all at once by using liquid droplets, and then, temporarily bonded to the wafer. The wafer is named Reconfigured Wafer. The self-assembly-based multichip-to-wafer 3D stacking is called reconfigured-wafer-to-wafer 3D integration. The alignment accuracy is found to be within 1 μm and the temporal bonding strength is well controlled by the quality of oxides as a bonding interface material, liquid types (concentration of additives), total bonding area, and surface roughness of the oxides. The self-assembled and temporarily bonded chips are successfully transferred to another wafer in a face-to-face bonding manner in batch processing.

Published in:

3D Systems Integration Conference (3DIC), 2011 IEEE International

Date of Conference:

Jan. 31 2012-Feb. 2 2012