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Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding

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16 Author(s)

Among the technological developments pushed by the emergence of 3D Stacked IC technologies, temporary wafer bonding and thinning have become key elements in device processing over the past years. While these elements are now mature enough for high-volume manufacturing, thin wafer debonding and handling still remain challenging. Hence this work focuses on a novel ZoneBOND approach to face these challenges.

Published in:

3D Systems Integration Conference (3DIC), 2011 IEEE International

Date of Conference:

Jan. 31 2012-Feb. 2 2012