IEEE Transactions on Advanced Packaging

Aims & Scope

IEEE Transactions on Advanced Packaging was the number two most-cited journal in manufacturing engineering in 2003, according to the annual Journal Citation Report (2003 edition) published by the Institute for Scientific Information. This publication has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.

Persistent Link: https://ieeexplore.ieee.org/servlet/opac?punumber=6040 More »

Frequency: 4

Subjects

  • Components, Circuits, Devices & Systems

Contacts

Editor-in-Chief
Ganesh Subbarayan
Purdue University, School of Mechanical Engineering
585 Purdue Mall
West Lafayette, IN  47907  47907  USA
ganeshs@purdue.edu
Phone:+1 765 494 9770
Fax:+1 765 494 9770