Nano-Silver Pressureless Sintering Technology in Power Module Packaging

Power electronics may operate at high temperatures even above 200∘C. In recent years, silver sintering technology is being gradually applied in high-temperature power electronic packaging due to its excellent thermal, electrical, and mechanical properties. Compared with early pressure-assisted silver sintering technology, silver pressureless sintering technology can simplify the sintering process and reduce capital investment. Silver sintering technology in chip-level and substrate-level packaging is presented as follows: firstly, the traditional and the state-of-the-art chip-level silver pressureless sintering technologies are reviewed: Secondly, the large-area substrate-level silver pressureless sintering technology is introduced, optimized and verified by experiments. Finally, the challenges and future outlook of silver pressureless sintering technology are summarized.