A Multi-Objective Approach for Rapid Identification of Post-Cu Interconnect Candidates

Identifying an Interconnect that will replace Cu will require the identification of a material that can meet a variety of materials design requirements and constraints. We propose an approach to simplify these hard to compute design to constraints into simple metrics. With the help of multi-objective optimization techniques, we are able to screen 15,000+ candidate metals rapidly. We present the workflow to identify candidate materials for high stack and low stack interconnects based on this approach.