The Impact of Rough Interfaces and Tilt Angles on Thermal Cycling Reliability of Through Glass Via

With the ongoing trend toward high integration and miniaturization in electronic devices, chip power density has increased substantially, posing significant challenges to thermal management and structural integrity in electronic packaging. Through Glass Via (TGV) technology, known for its excellent insulating properties and superior high-frequency performance, has become a key interconnection solution in 3D integration. However, the substantial disparity in coefficient of thermal expansion (CTE) among constituent materials and limitations in fabrication processes often result in X-shaped cross-sectional profiles of TGV. These geometric imperfections contribute to localized stress concentration and increase the likelihood of interfacial failure. To address this, a three-dimensional Weierstrass–Mandelbrot(W-M) fractal function is employed in this study to model TGV interfaces with various tilt angles and surface roughness levels. Finite element simulations under thermal cycling conditions are conducted to evaluate the influence of these parameters on stress distribution and residual deformation. The results demonstrate that both interface roughness and tilt angle have a pronounced effect on the thermal stress response of TGV structures.