An Efficient Modeling Method for Multiphysics Analysis of 3-D Interconnects

As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently multiphysics, multiscale, and large in computational scale. This article addresses these challenges by developing an electrical–thermal–mechanical co-simulation based on the discontinuous Galerkin finite-element method (DG-FEM). The governing equations for the three fields are formulated in a unified manner, enabling their effective solutions through a single DG-FEM framework. Since DG-FEM naturally supports the handling of nonconformal meshes, the mesh generation process is significantly simplified when handling multiscale models. Furthermore, a GPU parallel acceleration technique is applied to improve computational efficiency for large computational problems. The capability of the method in performing multiphysics simulations is demonstrated by several numerical examples of interconnect structures, achieving GPU speedups of over 20 times. Through simulations, detailed temperature and local stress distributions are efficiently obtained, providing critical insights into interconnect reliability.