A Novel Ultra-Thin Dicing Die Attach Film for Various Dicing Processes

A new ultra-thin DDAF that can be used in various dicing processes “Saw dicing”,”Laser ablation”, “Cool Expansion”, and”Plasma dicing" has been developed. To accommodate these four processes in the single DDAF, the key design points for each process will be explained. For “Saw dicing” and “Cool Expansion,” a high modulus of elasticity is required to minimize chipping due to vibration of the DAF material and for vitrification of the DAF at low temperatures. For “Laser ablation”, a low modulus is required to vaporize the DAF without residue when the DAF itself is ablated. To improve the DAF given the above tradeoffs, we attempted to solve the issue by adding UV curability to the DAF material. For”Plasma dicing”, by making the DAF material itself thinner (Target thickness: 3μm) and by using a non-filler design, it is possible to dice without residue, thus significantly reducing the processing speed per wafer. The developed DAF passed package reliability testing.