Wafer Bonding as Next Generation Scaling Booster

Latest technology trends, focus products and related requirements in the semi-conductor industry are being reviewed and latest direct bonding approaches and their features are introduced. For wafer level bonding, as for all semi-conductor manufacturing processes, higher level data gathering and analysis as well as predictive modelling becomes more and more important and are being presented. Latest developments, improvements as well as a roadmap looking to the next years is shown.