A Technical Optimization of Waferless Auto Clean for Aluminum Etcher

Aluminum etching by-products accumulate in the inner wall of the process chamber, the failure to remove such etching products would lead to the shift of chamber condition. In this regard, the paper has developed an efficient waferless auto clean (WAC) to facilitate the by-product removal of aluminum etching chamber. It is found that clean efficiency can be improved by the optimization of cleaning step sequence, the introduction of 4 CH in the 12 C cleaning step and the introduction of $\mathrm{C1} 2$ in the 2 O cleaning step