Application of novel nozzle-scan coating technique to ferroelectric film fabrication

A novel "nozzle-scan coating" technique, which could dramatically reduce the material waste and the rinse, was applied to fabricate ferroelectric thin film capacitors. In this coating technique, the dispenser nozzle is constantly scanning back and forth while the wafer is sent at a scan pitch in the direction normal to the nozzle scan direction. The thickness range of the obtained film was smaller than 5% for an 8 inch wafer. Ferroelectric performance in a test capacitor of Pt/SrBi/sub 2/(Ta,Nb)/sub 2/O/sub 9//Pt was equal to that by the conventional spin-coating technique. The coating time is within 60 sec for an 8 inch wafer with 50-75% of the solution efficiency. This technique would reduce the material cost to 1/10 and has an environmental merit of reducing waste of the organic rinse.