Development of environmentally preferred plastic ball grid array, PBGA, components

The movement of the market to environmentally improved components is being driven by proposed legislation in Europe and Japan. Many corporations in Japan have publicly stated their intentions to convert to no-Pb solders and components in the next 2 to 3 years. The restriction of halogenated compounds is also expected in the coming years. This paper will document the activities of a cross functional team formed within Motorola to develop the materials and processes to produce Pb (lead) free and halogen free PBGA (plastic ball grid array) packages for the assembly of integrated circuits to circuit boards using Pb free solder paste. Results of component and board level reliability experiments are presented.