Firmware complex for the acoustic diagnostic of line defects in semiconductors

Most modern integrated circuits and semiconductor devices experience strong current loads. This leads to the creation of areas of local heating and high temperature gradients. High currents and thermal expansion promote the formation of point and line defects both in the bulk and on the surface of the semiconductor. Moreover, the long-term current effects can result in breakaway and motion of line defects. This situation is accompanied by an acoustic emission (AE), the monitoring of which allows in situ investigation of the mechanical properties of materials and the study of the physical nature of durability and plasticity. Therefore, the purpose of this work is the construction and approbation of a firmware complex for the acoustic diagnostic of line defects in semiconductors.