Sop welding joint bending stress finite element analysis and optimization

This paper mainly uses ANSYS software to establish the finite element analysis model of SOP welded joints and analyze the stress distribution of SOP welded joints under bending load. A finite element model of the SOP device was developed for different solder joint materials and solder joint morphology parameters, and several sets of simulation data were obtained by model solving, and the results were analyzed based on the data. The results show that: Under bending load, the maximum stress occurs at the solder joints located at the four corners, and the maximum stress at the solder joints is located on the edges of the solder joints close to the chip side; The maximum stress in the solder joints of SOP devices is minimized when the solder joint material is 63Sn37Pb, all other conditions being equal; The optimal combination of optimum solder and solder joint structure parameters is solder 63Sn37Pb, solder joint height 0.085mm, solder joint length 1.74mm, and solder creep height 0.33mm. Theoretical guidance is provided for reducing the maximum bending stress in the solder joints of SOP devices under reduced bending load.