A Die-Level, Replaceable Integrated Chiplet (PINCH) Assembly Using a Socketed Platform, Compressible MicroInterconnects, and Self-Alignment

This article presents a novel die-level, rePlaceable INtegrated CHiplet (PINCH) assembly using a socketed platform. To enable the replaceability of this tightly integrated system, an appropriate set of enabling technologies is required. To this end, the PINCH assembly incorporates a nonpermanent, off-chip interconnection system via compressible microinterconnects (CMIs) and a nonpermanent self-alignment technology using positive self-alignment structures (PSAS) in a PSAS-to-PSAS configuration. As the PSAS-to-PSAS self-alignment technology is substrate agnostic, the PINCH assembly can also incorporate heterogeneous integrated systems. This article discusses this PINCH assembly and it provides a design analysis for building this socketed system. The fabrication of all the components of the PINCH assembly (e.g., chiplet, interposer) is then performed, followed by a manual assembly process using the PSAS-to-PSAS self-alignment technology. Four-point resistance of the 150-
$\mu \text{m}$
pitch and 200-
$\mu \text{m}$
pitch CMIs is then measured after the socket is secured into the socket base of the PINCH assembly.