Electrical Resistance of Solder Joints on Conductive Ribbons

The paper deals with high humidity and high temperature ageing reliability of joints soldered / glued by non-conductive adhesive (NCA) onto the conductive ribbon. The prepared samples were accelerated aged at $85 \, ^{\circ}\mathrm{C}$ temperature and 85 % RH for 1000 hours. The main goal of the experiment was to verify the possibility of using soldering to make a conductive connection of components onto the ribbon. The joints electrical resistance was measured before, during and after ageing. The results show that using of soldering to ensure the conductive connection of components onto the ribbons is suitable and reliable. Also the using of non-conductive adhesive for this connection can be possible, but this option should be more tested and a suitable temperature limit should be found.