A flip-chip power electronics packaging technology on a flexible polymeric substrates

A power electronics packaging technology with flip-chip attachment on a flexible polymeric substrate was developed. The advantage of the flexible polymeric substrate is its ability to conform to unique geometrical configurations to meet specific ergonomic or space considerations in electronic systems. To further improve its packaging density, a double-sided flexible polymeric substrate was employed. In this demonstration project, a DC-DC switching converter was fabricated with the flip-chip power electronics packaging concept on a flexible substrate. This paper discusses the design, fabrication, and testing of a prototype converter, as well as the pros and cons of this type of packaging.