Leading edge review: What is an important factor of CMP consumables for 3D Integration Bonding?

Chemical mechanical polishing (CMP) plays important role in the fabrication process of low temperature bonding for 3D integration. Based on our previous reports of the CMP of Si and sapphire wafers, it is well known that the various consumable used in the CMP strongly affects the material removal rate. However, CMP studies has serious problem in area such as the processing characteristics on the actual 3D integrated device wafer. This paper will show the leading edge review that what is an important factor of CMP for 3D integration bonding as well as introduce our new collaborative projects.