Variations in Electrical Conductivity of Phenolic-based Adhesives Containing Copper Particles Treated with a Carboxylic Acid during Environmental Test

Variations in electrical resistivity of copper-filled phenolic-based electrically conductive adhesives were examined during exposure to 85 °C/85 %RH and 85 °C (<;1%RH) environments. The copper fillers were treated with several amounts of oleic acid prior to preparation of the adhesives. Increase in electrical resistivity was accelerated in the humid environment. However, the surface treatment using appropriate amount of oleic acid was found to be effective to improve electrical reliability of the adhesives.