Microwave Power Absorption Evaluation of Micro-Particles Cuo Filler Reinforced Epoxy Composites

Epoxy resin is of the most used materials in the field of insulating purposes such as in high voltage applications. In order to create an enhanced material with new properties, epoxy resin can be processed by using different fillers. In this paper, microwave power absorption evaluation of Micro-particles CuO filler reinforced epoxy composites is investigated. CuO metal oxide loadings were taken in four different percentages as (5%, 10%, 15%, and 20%) of the full sample size. Samples were casted in a square shape of (10 cm) side length along with four different thicknesses stated as 1mm, 2mm, 3mm, and 4mm for each loading value. Within an x-band frequency range of 8-10 GHz, the objectives of this paper were examined to determine the amount of microwave power absorption when each loading value is tested with its four different thickness values taken in consideration. The epoxy resin samples were prepared and tests were done to measure the microwave power absorption for each sample in the x-band frequency range. Generally, it has been found that the microwave power absorption is proportional to the thickness value whether it was a pure epoxy composite or a reinforced composite. Moreover, the test results revealed that the case of the (5%) CuO metal oxide filler is significantly related to the maximum power absorption when compared to other loading percentages. The obtained results provided information about the influence of the CuO filler on the insulating property of the non-filled epoxy specimens. Therefore, this composite could be regarded for applications where absorbing microwave energy is of importance and utmost necessity.