Investigation of Simultaneous Effects of Surface Roughness, Porosity, and Magnetic Field of Rough Porous Microfin Under a Convective–Radiative Heat Transfer for Improved Microprocessor Cooling of Consumer Electronics

The ever-increasing demand for high-processing compact electronic systems has unequivocally called for improved microprocessor performance. However, increasing microprocessor performance requires increasing power and on-chip power density, both of which are associated with increased heat dissipation. Electronic cooling using fin has been identified as a reliable cooling approach in miniaturized electronic systems. However, an investigation into the thermal behavior of fin would help in the design of miniaturized, effective heatsinks for reliable microprocessor cooling. The aim of this paper is to investigate the simultaneous effects of surface roughness, porosity, and magnetic field on the performance of a porous microfin under a convective-radiative heat transfer mechanism. The developed thermal model considers variable thermal properties according to linear, exponential, and power laws, and is solved using the Chebychev spectral collocation method. A parametric study is carried out using the numerical solutions to establish the influences of porosity, surface roughness, and the magnetic field on the microfin thermal behavior. The results of the simulation establish that thermal efficiency of the microfin is significantly affected by the porosity, magnetic field, geometric ratio, nonlinear thermal conductivity parameter, thermogeometric parameter, and the surface roughness of the microfin. Furthermore, the study establishes that the fin efficiency ratio which is the ratio of efficiency of the rough fin to the efficiency of the smooth fin is found to be greater than unity when the rough and smooth fins of equal geometrical, physical, thermal, and material properties are subjected to the same operating condition.