Design and Analysis of Microchannel for the Thermal Management of Multi-stacked LTCC Laminates

In micro-system packaging, the high-density integration of various chips and devices on the substrate imposes high demand on the heat dissipation capability of the substrate. LTCC substrates have been widely used in the packaging of radio frequency/microwave integrated circuits due to their satisfactory heat resistance, thermal conductivity, convenient and flexible wiring, and low coefficient of thermal expansion [1]. For high integration and miniaturization as required by modules like high-power T/R components, under the current process conditions, it is difficult to fulfil the requirements with just one single substrate, so two or more stacked LTCC substrate laminates in one package must be considered. However, the thermal management of stacked laminates is a challenge to be overcome. In this paper, ANSYS software is used to physically model the structure of a microchannel network, namely a dual-layer spiral and serpentine microchannels. The heat-dissipating capability of the connected microchannel substrate mainly depends on the temperature rise of the lower substrate which containing the fluid outlet. The water mass flow rate at the inlet is controlled at 45ml/min can meet the heat dissipation requirements of 15W/cm
²
at the heat source of the upper and lower substrates, which can expand the applications of LTCC-based microwave power module, and can provide the technology support for miniaturized equipment.