Low interconnection loss and low-cost approach for Antenna in Package of 77GHz Automotive Radar applications

This work provides a low-cost Antenna in package (AiP) implemented on a Advanced single sided substrates (aS
³
package) for 77 GHz automotive radar applications. This work demonstrates firstly the 77GHz losses of the transition from chip to package among flip-chip ball grid array (FCBGA) package, flip chip chip scale (FCCSP) package, Fan-out WLP, and aS
³
package. Although Fan-out WLP can minimizes 77-GHz losses of transition from chip to package plus package to PCB, low-cost solutions for 77 GHz AiP are importance opportunity for automotive radar applications. The provided AiP solution on aS
³
package has low losses of transition from chip to package and the performance meets the requirements of 77 GHz automotive radar systems. aS
³
package uses low-cost substrate and lower cost assembly process than Fan-out WLP. This work proposes a low-cost 77GHz AiP solution, and it is suitable for automotive radar applications.