Integration of Jet Impingement Cooling With Direct Bonded Copper Substrates for Power Electronics Thermal Management

The ability of packaging solutions to meet the high heat flux dissipation of power electronics relies heavily on effective thermal management strategies. During operation, power electronic devices generate high temperatures that can cause device degradation. To remove this heat from the devices, heat spreaders and cold plates are often used. However, the multiple layers that compose the module often lead to high thermal resistances that hinder heat dissipation and can give rise to interfacial failures. To address these challenges, this paper has investigated the direct integration of single-phase jet impingement cooling at the power electronic substrate level for improved thermal management. This method was evaluated using computational models, experiments, and analytical models. An optimization analysis was performed to determine the influence of various design parameters on the cooling system. Through the directly integrated cooling concept, a reduction of up to 25% in the total package thermal resistance compared to a conventional device package was achieved. In addition, the overall device temperature was reduced, and the thermal resistance was found to be between 0.21 °C/W and 0.47 °C/W for a heat dissipation of 100 W/cm
²
.