Effects of Metal–Interlayer–Semiconductor Source/Drain Contact Structure on n-Type Germanium Junctionless FinFETs

In this paper, the effects of a metal- interlayer-semiconductor (MIS) source/drain (S/D) structure with a heavily doped interlayer on enhancement-mode n-type germanium (Ge) junctionless FinFETs (JLFETs) are demonstrated via 3-D technology computer aided design simulation. N-type Ge JLFETs using metal- semiconductor (MS) S/D structures face difficulty in operating in the enhancement mode, as severe Fermi-level pinning (FLP) triggers extremely high off-state current (I
_OFF
) and extremely low on-state current (I
_ON
). The MIS S/D structure can solve these problems by mitigating FLP. In the simulation of an n-type Ge JLFET with the MIS S/D structure, IOFF of 9.42×10
^-10
A/μm, ION of 6.09×10
^-4
A/μm, and subthreshold slope of 65.38 mV/dec are achieved. The performance of the device for different channel-doping concentrations and fin dimensions is also evaluated. Thus, an MISS/D structure with a heavily doped interlayer can effectively strengthen the performances of n-type Ge JLFETs beyond the sub-7-nm technology node.