Integrated thermally actuated MEMS switch with the signal line for the out-of-plane actuation

Design, fabrication and experimental characterization of a MEMS switch integrated with the signal line on the same chip is presented in this paper. The mobile electrode is out-of-plane actuated to close an electrical circuit. In the case of MEMS switches, the interest is orientated to the attainable force and displacement. The investigated switch structures can be implemented in MEMS applications where a thermal gradient occurs for sensing or actuation. If a thermal gradient is directly applied on anchors, based on the thermal dilatation of hinges and considering different dilatation coefficients between mobile structure and substrate, the mobile electrode is moved toward the signal line. The mechanical structure is fabricated from aluminum on a silicon substrate. After fabrication, the investigated switch is experimentally characterized in order to determine the mechanical stiffness and the adhesion force between electrodes.