Thermal analysis of a suspension with an IC-chip

Excellent NLTS characteristics at high write frequencies beyond 150 MHz have been realized by a suspension with an IC-chip named "chip on suspension". The IC-chip, however, causes the temperature rise of both the IC-chip and a merged MR head. The thermal deformation of the suspension is also very critical for flying characteristic of a slider in HDD. Therefore, we have numerically analyzed the thermal distribution and thermal displacement of the suspension with the IC-chip using a 3D-FEM program. The heat of the IC-chip hardly causes the temperature rise of the head. The maximum change of head loading force was simulated to be around 0.04 gram.