Novel parametric electromagnetic modelling to simulate Textile Integrated Circuits

In this work, a parametric electromagnetic (EM) modelling to develop Textile Integrated Circuits (TIC) is presented. Due to the necessity of having an accurate model to design TIC, avoiding the simulation of every filament which forms each yarn, a three-step characterisation of textile structures has been carried out. First, an ideal non-deformed model of the textile structure is represented, taking into account every filament which forms each yarn, when using multifilament threads. This model would then be adjusted depending on the different forces working between the yarns modifying the distribution of the filaments and deforming the yarns. Secondly, an EM equivalent model of the structure is presented, which is formed by monofilaments with the deformed cross section. This equivalent second model is easier to work with and its simulation is more efficient in terms of computational resources. Finally, an equivalent three-layer EM model is presented, which corresponds to the conventional simulation of substrate integrated circuits. The three models are electromagnetically equivalent and allows the user to simplify the TIC simulation process.