1D/2D hybrid mesh PEEC solver for the analysis of multilayer planar circuits

To minimise the number of cells required for analysing numerically a planar circuit, an hybrid meshing technique that combines 1D and 2D cells is presented in this work. Thanks to this discretization procedure of the Partial Element Equivalent Circuit (PEEC) method, the connectivity between 1D and 2D model partitions is made using an unstructured mesh. In this way, it is possible to match regions of the layout with different number of cells at their common interface. The method is applied to the simulation of finger capacitors in a multilayer low temperature co-fired ceramic technology and it is verified with experimental data.