Thermal decomposition of low-k pulsed plasma fluorocarbon films

Low-k fluorocarbon films have been deposited by pulsed plasma chemical vapor deposition (CVD) and their thermal stabilities have been examined. We have observed and identified at least two mechanisms for thermal decomposition. We have been able to eliminate the most labile decomposition route by increasing substrate temperature during deposition. Enhanced decomposition due to ex-situ oxygen exposure has also been observed.