A new breed of ball grid array package

Overmolded PBGA(Plastic Ball Grid Array) package has been favorably introduced because of its advantages over fine-pitch PQFP(Plastic Quad Flat Package), such as smaUer footprint, better electrical and thermal performance, superior surface mountability, etc. From the viewpoint of thermal performance, two types of BGA packages, which show better thermal management capability than the overmolded PBGA package, have been developed. One is the PBGA package with cavity-down structure, which is not easy to manufacture, and the other is the ceramic BGA package. However, because both of them are fairly expensive to fabricate, a concept of BGA package With new configuration was developed to get the improved thermal performance at relatively low assembly cost.