Failure analysis on MEMS resonator device in wafer fabrication

This paper demonstrates a new de-process flow for MEMS resonator DRG (dc Resistance to Ground) failure analysis, using electrical fault isolation tool of TTVA to locate the defect site. After all, cutting method was performed to de-process MEMS from Si Cap, followed by SEM inspection to successfully observe the physical defect point. Auger analysis was then carried out on the defect point to identify the element contains, hence the root cause of preventing of Carbon and Mo was confirmed.