Ruthenium interconnect resistivity and reliability at 48 nm pitch

48 nm pitch dual damascene interconnects are patterned and filled with ruthenium. Ru interconnect has comparable high yield for line and via macros. Electrical results show minimal impact for via resistance and around 2 times higher line resistance. Resistivity and cross section area of Ru interconnects are measured by temperature coefficient of resistivity method and the area was verified by TEM. Reliability results show non-failure in electromigration and longer time dependent dielectric breakdown. Based on the data collected, Ru could be a metallization contender at linewidth of 16 nm and below.