25-Gb/s Operation of a Polymer Optical Waveguide on an Electrical Hybrid LSI Package Substrate With Optical Card Edge Connector

We propose a high-capacity polymer-based optical and electrical LSI package integrated with multimode Si photonic transmitters and receivers. We describe the fabrication and characteristics of the polymer-based hybrid LSI package substrate with a polymer optical waveguide, a mirror, and optical card edge connectors. We fabricated optical mirrors with several angles ranging from 40° to 45° for the Si photonic grating coupler by using a dicing blade at an angle. The dicing mirror changed the emission angle for the grating coupler. We also realized a large lateral misalignment tolerance (±11.5 μm) between the polymer waveguide and MMF for 1 dB of excess loss at 24 channels. We obtained 1-dB coupling loss using an optical card edge connector at 1.3 μm because of the large tolerance. We realized 25-Gb/s error-free transmission per channel at 1.3 μm. We also describe here the error penalty and jitter due to modal noise generated by coupling mismatch.