Plasma Metallization Coating and Its Adhesion to Microwave Transistor Substrate—Part 2: Experimental Study of 3-D Composite Coating

This paper reports an experimental study of the previously proposed mechanism of adhesion of a plasma metal coating to a ceramic substrate by an example of beryllium oxide. This adhesion mechanism is based on the increase in the concentration of structural defects (vacancies) and electron exchange interaction of a metal-oxide beryllium pair during the plasma thermal activation of the process. Given the brazing of ceramic products with hard solders in hydrogen, the coating composition for metallization is determined. The optimal temperature of reactive plasma metal coating for strong adhesion to the ceramic substrate is found. Methods to improve the technology of plasma vacuum metallization using ion-plasma magnetron sputtering and ion implantation are proposed. Recommendations for the deposition of 3-D composite coatings with maximum adhesion are given.