Wafer scale photonic-die attachment

A diebonding system has been developed for the bonding of photonic chips, such as lasers and photo detectors, at a rate suitable for low cost manufacturing. This system is designed for wafer scale diebonding, making it compatible with wafer scale fabrication. This system combines the passive positional optical alignment of photonic chips on a silicon or glass wafer board surface with materials handling in order to make the process manufacturable. The process is fluxless, minimizing contamination of optical surfaces, and diebonding is controlled to a very small area allowing localized attachment of many die without disturbing previously placed die.